Consist of more than 500 different end-users of the company's ultrasonic power supplies and transducers. In addition, 90 percent of the company's OEM sales were made to a number of bonding machine manufacturers including ASM International; F & K Delvotec S.A.; Dias Automation Ltd.; Marpet Industries, Inc.; Hybond, Inc.; SMH (Taiwan); ESEC; Mitsubishi, Hesse and Knipps, and many other equipment manufacturers.
Other customers include captive semiconductor manufacturers who produce bonding machines for their own use or for resale, such as General Motors, Philips, Hitachi, IBM, Texas Instruments, and Toshiba.
